LAB FAB for smart sensors and actuators MEMS ENIAC KET Pilot Line 2012
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Project

                          According to the outcomes of the High Level Group on KET, the main driving force behind the development of future innovative goods and services will be Key Enabling Technologies (KETs), such as nanotechnology and nanoelectronics including semiconductors. During the last decade, “More than Moore” technologies have marked the largest innovation of semiconductor industry, by unleashing the major killer apps of today’s consumer, health care and industrial market (e.g. MEMS motion sensors, portable healthcare devices and robotics). In this frame, Europe has got some well recognized leading centres of excellence on “More Than Moore” technology and, even more, it has the necessary industrial critical mass and investment scale to successfully pursue the development of innovative microelectromechanical systems (MEMS) sensors and 3D packaging.

General Goals
Innovations generated by these coordinated technology capabilities are expected to fuel the next generation’s smart sensors and actuators based on MEMS, targeting the following market drivers:

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Drivers,Technology,Applications,
Microactuators,Silicon MEMS based on piezoelectric thinfilms(PZT),Data Storage,
Micropumps,Silicon MEMS based on piezoelectric thinfilms(PZT),Ink Jet,
Sensors,Silicon MEMS based on piezoelectric thinfilms(PZT),Health Care,
Energy scavengers,Silicon MEMS based on piezoelectric thinfilms(PZT),Energy Scavenging,
Magnetic field sensors,Silicon-based anisotropic magnetoresistance(AMR) materials,GPS positioning,
Magnetic field sensors,Silicon-based anisotropic magnetoresistance(AMR) materials,Mobile Phones,
Full 3D integration through advanced packaging technologies, Flip Chip, Body area sensors,
Full 3D integration through advanced packaging technologies, Through Silicon Vias, Remote monitoring,
Full 3D integration through advanced packaging technologies, Through Mold Vias,,
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The research leading to these results has received funding from the European Community under the ENIAC Nanoelectronics Framework Programme (Call ENIAC-2012-2) under grant agreement no Lab4MEMS(325622-2)