LAB FAB for smart sensors and actuators MEMS ENIAC KET Pilot Line 2012
Header

Dissemination

 

  • “A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging ”, Aldo Ghisia, Stefano Mariania, Alberto Coriglianoa, Giorgio Allegatob, Laura Oggioni. Click Here.
  • “Thermo-mechanical Reliability of Gold Stud Bump Bonding for Large Volume MEMS Devices”, The 65th Electronic Components and Technology Conference (ECTC), M.M.V Taklo et al, May 26 – 29, 2015 San Diego, California
  • “Optimization of Sensing Stators in Capacitive MEMS Operating at Resonance”, IUNET, A. Frangi, G. Laghi, G. Langfelder, P. Minotti, S. Zerbini – Journal of Microelectromechanical Systems, in press, DOI: 10.1109/JMEMS.2014.2381515
  • “A Low-Noise Sub-500-uW Lorentz Force Based Integrated Magnetic Field Sensing System”, IUNET, S. Brenna, P. Minotti, A. Bonfanti, G. Laghi, G. Langfelder, A. Longoni, A. L. Lacaita – IEEE MEMS 2015, Lisbona, January 2015
  • “Torsional MEMS magnetometer operated off-resonance for in-plane magnetic field detection”, IUNET, G. Laghi, S. Dellea, A. Longoni, P. Minotti, A. Tocchio, S. Zerbini, G. Langfelder, Sensors and Actuators A 229 (2015) 218–226
  • “Evaluation of the piezoelectric properties and voltage generation of flexible zinc oxide thin films”, Center for Space Human Robotics, Istituto Italiano di Tecnologia (IIT), M. Laurenti, et al., Nanotechnology 26 (2015) .
  • “Selected questions related to characterization of MEMS structures comprising PZT piezo layer”, NATO Advanced Research Workshop 2015: Functional Nanomaterials and Devices for Electronics, Sensors, Energy Harvesting, April 13-16, 2015, Lviv, Ukraine. –  J. Zając, T. Gutt, T, Piasecki and P. Grabiec. Click Here.
  • “RF MEMS TPoS using FE modelling”, in Proceedings of the Conference on Design, Test, Integration & Packaging of MEMS/MOEMS, 2015. R. Farrugia, I. Grech, O. Casha, J. Micallef, E. Gatt.
  • “Investigation of Warpage in Wafer-level Molding: Measurement and FE Analysis”, in Proceedings of the Conference on Design, Test, Integration & Packaging of MEMS/MOEMS, 2015. R. Farrugia, I. Grech, O. Casha, J. Micallef, E. Gatt, I. Ellul, R. Duca, I. Borg.
  • Thermocompression Bonding Evaluation for Package Size Reduction, under Lab4MEMS – WICT Conference 2014, Malta; David Oscar Vella Assembly Process Industrialisation STMicroelectronics Malta; Joshua Borg AMS Division STMicroelectronics Malta; Maaike Margrete Visser Taklo Department for Instrumentation SINTEF Norway; Alastair Attard Process Development Besi Austria GmbH Austria.
  • EUROPEAN 3D TSV SUMMIT (Jan 20-22, 2014 – Grenoble) SEMI Europe is proud to announce the 2nd edition of the European 3D TSV Summit. Jan 20-22, 2014 in Grenoble (France).  – “3D Integrated Solution for Motion MEMS”, Marco Ferrera, MEMS Technology Manager, STMicroelectronics, Agrate Brianza, ITALY
  • Picosun and Cutting Edge Solutions for ALD (oral presentation), Nanomicro biz ROBOTECH exhibition, 23.-25.4.2014, Yokohama, Japan
  • Passivation and Change of Surface Properties of PZT by ALD for Micro-Electro Mechanical Systems (poster presentation), 14th international conference on atomic layer deposition (ALD 2014), 15.-18.6.2014, Kyoto, Japan
  • Invention disclosure on a novel technique for electrical connections in MEMS wafer level packaged devices by G. Feng, J. Kyynäräinen, M. Ylilammi and J. Meltaus. (VTT)
  • L4MEMS Workshop in Bertinoro Italy, 29th-30th August 2014, invited talk by Panu Koppinen, title: “MEMS based ultrasonics and their applications”; (VTT)
  • Talk entitled “Integration of piezoelectric materials for MEMS applications” at the LAB4MEMS Workshop in Bertinoro (Aug 29-30).( CEA-LETI)
  • Mention our participation in LAB4MEMS project during LETI invited talk at PiezoMEMS 2014 workshop in Kobe. ( CEA-LETI)
  • LAB4MEMS sponsorship was cited in LETI annual research report (Page 66)Click Here. ( CEA-LETI)
  • LETI mention its participation in Lab4MEMS project to its customers when presenting activities dealing with PZT material. ( CEA-LETI)
  • July 8, 2014 , SEMICON WEST, San Francisco, USA, TechXPOT : Open Presentation 20 min, title: Pulsed Laser Deposition of PZT Thin Film Enables New Options for Piezoelectric Actuation and Force Sensing, Authors: J.A. Janssens. (SolMateS)
  • Oct 28, 2014, PiezoMEMS workshop, Kobe, Japan: Plenairy Presentation 20min, Title: PZT on TiN bottom electrodes by Pulsed Laser Deposition, Authors J.A. Janssens, M.D. Dekkers. (SolMateS)
  • Several presentations to individual companies (SolMateS)
  • SEMI workshop “SEMI MEMS Tech Seminar, The future of MEMS: 2020 and beyond”, September 23, 2014. Politecnico di Milano, Italy: organization of the event jointly with Semi-Europe, seminar of Alberto Corigliano: “Future of MEMS, a mechanical perspective”. (Polimi)
  • An efficient earth magnetic field MEMS sensor: modelling and experimental results. IEEE MEMS2014, San Francisco, 26-30 January 2014.M. Bagherinia, A. Corigliano, S. Mariani, D. A. Horsley, Mo Li, E. Lasalandra.
  • SSI 2014, Vienna 26-27 March 2014, invited talk “Lab4MEMS: LAB FAB for smart sensors and actuators MEMS – ENIAC KET Pilot Line”, Author: Roberto Zafalon, ST Italy, Presenter: Alessandro Sanginario, IIT, Italy.
  • Multi-KET Conference, Brussels, April 3rd , 2014 . Invited keynote “Managing the complexity of a large Pilot Line activity”, Roberto Zafalon, ST Italy and Lab4MEMS GPM.
  • APCM 2014, 14th European Advanced Process Control and Manufacturing Conference, Roma 7-9 April 2014, Invited keynote “The Renaissance of Nanoelectronics and Smart Systems industry: More than Moore in the Italian eco-system”, Roberto Zafalon, ST Italy.
  • Numerical simulations of piezoelectric MEMS energy harvesters. Proceedings Eurosime 2014, Ghent, 7-9 April 2014. G.Gafforelli, R. Ardito, A. Corigliano, C. Valzasina, F. Procopio.
  • SINTEF PiezoMEMS Competence Centre – CIMTEC 2014 – 13th International Ceramics Congress (Montecatini Terme, June 8-13);
  • ALD 2014 – „14th International Conference on Atomic Layer Deposition” held in Kyoto, Japan during June 15-18, 2014 – Click Here
  • Low-temperature bonding technologies for MEMS and 3D-IC – LTB-3D 2014, Tokyo, Japan 15-16th July; M.M.V.Taklo1 , K. Schjølberg-Henriksen1 , N. Malik1, 5, H.R. Tofteberg1 , E. Poppe1 , D.O. Vella2, J. Borg2 , A. Attard3 , Z. Hajdarevic3 , A. Klumpp4 and P. Ramm4; 1 SINTEF, Oslo, Norway; 2 STMicroelectronics Malta, Kirkop, Malta; 3 Besi Austria GmbH, Radfeld, Austria; 4 Fraunhofer EMFT, Munich,Germany; 5University of Oslo, Oslo, Norway.
  • Off-resonance, low-pressure operation of Lorentz force MEMS magnetometers – IEEE Transactions on Industrial Electronics; Giacomo Langfelder, Member IEEE, Giacomo Laghi, Paolo Minotti, Alessandro Tocchio, and Antonio Longoni.
  • Lab4MEMS PhD School: “Smart Sensor and Actuators at the Age of Internet of Things”, hosted by the Sinano Summer School, August 29-30 2014, Bertinoro (Italy).  The School featured 10 distinguished lectures given by the partners of Lab4MEMS to a class of 50 international PhD students of the Sinano Summer School (ref. Programme).
  • SEMI-EUROPE MEMS Tech Seminar 2014, September 23rd 2014, Politecnico di Milano, Italy:
    • KEYNOTE Speech: “MEMS, a Platform for Augmented Reality”, SandroDalleFeste, MEMS Electronic Product Development Director, STMicroelectronics
    • Future of MEMS: “A Mechanical Perspective”, Alberto Corigliano, Professor of Solid and Structural Mechanics, Politecnico di Milano
    • Visit to POLIFAB (Politecnico di Milano’s Pilot Line and Clean-room for smart systems integration): 30 min/visit, limited to 5 groups of 5 people each

Picture1

  • Operation of Lorentz-force MEMS magnetometers with on-off current switching – ESSDERC meeting, Venezia, Italy, September 2014; G. Langfelder, C. Buffa, P. Minotti, A. Longoni Dipartimento di Elettronica, Informazione e Bioingegneria Politecnico di Milano Milano, Italy; A. Tocchio, S. Zerbini AMS Division ST Microelectronics Cornaredo (MI), Italy.
  • The 4th International Workshop on Piezoelectric MEMS, October 28-29 2014, Kobe University (Port Island Campus), Kobe, Japan  Click Here
    • L. Colombo (ST Microelectronics) : Pilot line integration for PiezoMEMS in the Lab4MEMS project
    • F. Tyholdt (SINTEF ICT) : PiezoMEMS development from idea to product – case examples from SINTEF
    • G. Le Rhun (CEA Leti) : Integrated piezoelectric devices : from material to prototypes
  • “Pilot line integration for PiezoMEMS in the Lab4MEMS project”, STMicroelectronics. – 4th International piezoMEMS Workshop, Kobe, Japan – October 28th-29th, 2014.
  • Smart Regional Financing for Key Enabling Technologies (KETs), Brussels 6th Nov 2014: “Lab4MEMS: Managing the complexity of a large Pilot Line dealing with “More than Moore” technology”, Roberto Zafalon, EU Technology Programmes Director, STMicroelectronics Italy.
  • EUROPEAN NANOELECTRONICS FORUM 2014, 26-27 November 2014, Cannes (France). Exhibition booth and POSTER of Lab4MEMS.
  • Lab4MEMS ENIAC Poster – European Nanoelectronics Forum 26-27 November 2014 in Cannes, France – Click Here for poster
  • Experimental verification of a bridge-shaped, non-linear vibration energy harvester. Proceedings IEEE Sensors, Valencia, November 3-5 (2014). G. Gafforelli, R. Xu, A. Corigliano, S.G. Kim.
  •  NCP versus NCF for Thermocompression MEMS bonding using Gold Stud Bumps – IWLPC 2014, San Jose, CA, USA November 11-13; Maaike M. Visser Taklo, Astrid-Sofie Vardøy SINTEF OSLO, Norway; Alastair Attard, Zlatko Hajdarevic, Stephan Bulacher Besi Austria GmbH Radfeld, Austria; Mario Saliba, Jan Wijgaerts Henkel Electronics Materials Westerlo, Belgium; Joshua Borg, David Oscar Vella STMicroelectronics Malta Kirkop, Malta.
  • Modeling of a bridge-shaped nonlinear piezoelectric energy harvester. Energy Harvesting and Systems. 1(3-4), 179–187, DOI:10.1515/ehs-2014-0005 (2014).G. Gafforelli, R. Xu, A. Corigliano, S.G. Kim. Experimental verification of a bridge-shaped, nonlinear vibration energy harvester. Applied Physics Letters, 105, 20, 203901-4 (2014). G. Gafforelli, R. Xu, A. Corigliano, S.G. Kim.
  • “Warpage issues in large area mould embedding technologies”, Xjenza Online Vol. 2 Iss. 2. December 2014. R. Farrugia, I. Grech, O. Casha, J. Micallef, E. Gatt, R. Duca ,C. Cachia.
  • “A Study on Piezoelectric PZT in RF-MEMS Applications” in Workshop in Information and Communication Technology, 2014. R. Farrugia, I. Grech, O. Casha, J. Micallef, E. Gatt.
  • “Design and Simulation of Test Structures for Anisotropic Magneto-Resistive Sensors”, in Workshop in Information and Communication Technology, 2014. B. Portelli, I. Grech, O. Casha, J. Micallef, E. Gatt,
  • Press Release, 19th March 2013: “STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping through CMP” – ST’s THELMA MEMS manufacturing process, the process used for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP. ST is releasing this process technology to third parties as a prototyping and foundry service, to encourage new developments in motion-sensing applications for consumer, automotive, industrial and healthcare markets. – Click Here!
  • Lab4MEMS Press release, April 4th 2013, Click Here!
    • Media Coverage: as of April 5th 2013.
    • ST starts pilot line for advanced MEMS, Peter Clarke, EE Times
    • STMicroelectronics to develop next-generation MEMS pilot line with Lab4MEMS, Julien Happich, EE Times Europe
    • STMicroelectronics NV Coordinates with Partners European Research to Secure Lead in Advanced MEMS Devices, Reuters Significant Developments
    • ST Leads EU Next-Gen MEMS Project, David Manners, Electronics Weekly – “Mannerisms” blog
    • ST heads EU MEMS project, Laura Hopperton, New Electronics
    • ST leads European advanced MEMS R&D project, TelecomPaper
    • STMicroelectronics heads European research team in advanced MEMS devices development, Solid State Technology
  • LAB FAB for smart sensors and actuators MEMS” ENIAC KET Pilot Line 2013”, 3rd International piezoMEMS Workshop, Washington DC, 9-10 April 2013 -R.Zafalon, all Consortia. Click Here!
  • Lab4MEMS ST Press Release 4 April 2013 „STMicroelectronics Leads European Research to Secure Lead in Advanced MEMS Devices” – Lab4MEMS, an ENIAC Pilot-Line project, leverages ST’s end-to-end MEMS facilities to develop enabling technologies for next-generation applications
    Click Here
  • 3rd International PiezoMEMS Workshop April 9-10, 2013, Washington DC, USA. – Lab4MEMS: LAB FAB for smart sensors and actuators MEMS – Click Here;
  • EU’S FUTURE STRATEGY FOR MICRO- AND NANO-ELECTRONICS” event on 29 May 2013, Presentation to EC Commissioner Neelie Kroes, Slides + Video + PR by the EC – Click Here! and Here!
  • 5 Pilot Lines 2012 EUROPA – EC PRESS RELEASES 29 May 2013 „Five major projects announced as part of new EU Electronics strategy”
    Click Here
  • IEEE MDM Conference 2013, Milano 4-6 June 2013, Invited Keynote speech: “Smart System and MEMS Design: Industrial Challenges and Perspectives” by Roberto Zafalon, Thursday 6th of June 2013. – Click Here!
  • ST presented Lab4MEMS at the EuroNanoforum 2013, 18-20 June 2013. Session ‘KET case studies’, speaker Dominique Thomas. – Click Here!
  • SEMI Tech Seminar on MEMS – ST Castelletto on September 26th „Bringing MEMS science to the heart of MEMS industrial success”26Sept 2013; Cornaredo (Castelletto) – Italy; Hosted by STMicroelectronics – Click Here!
  • SEMI Workshop on MEMS, hosted by ST in Castelletto (Milano, Italy), September 26th 2013 , Lab4MEMS ENIAC KET Pilot Line, presented by prof. Alberto Corigliano, Politecnico di Milano. – Click Here!
  • Interview with Paula Doe of Yole Developpement (CA, USA), published as an Article in the October issue #16 of MEMSTrends from Yole Developpement. – Click Here! and Here!
  •  “What’s next for MEMS technology?”(pag8-11) – MEMS Trends issue #16, October 2013 Click here for pdf!      Click here for online reading!
  • „STMicroelectronics Leads European Research to Secure Lead in Advanced MEMS Devices”, Geneva 4 Aprilie 2013: Click Here.
  • „Five major projects anunced as part of new EU Electronics strategy”, Bruxels 4 Mai 2013: Click Here.

The research leading to these results has received funding from the European Community under the ENIAC Nanoelectronics Framework Programme (Call ENIAC-2012-2) under grant agreement no Lab4MEMS(325622-2)