Lab4MEMS is a R&D project funded by the European Community under the ENIAC Nanoelectronics Framework aiming to establish a European Pilot Line for key enabling technologies on advanced piezoelectric and magnetic materials, including advanced 3D Packaging technologies to meet the ever evolving market needs.
The Pilot Line is promoted to reinforce the manufacturing facilities currently located in each respective participating country, aiming to implement and optimize the industrial processes and to validate the supply chains and the demonstrators suitable to penetrate the market. The main industrial Pilot Line is located in STMicroelectronics among Italy and Malta, well supported by R&D Centres, SMEs and Research Labs distributed among the 9 european countries of the consortia, streaming the whole manufacturing chain from front-end to back-end. The project started in January 2013 and will continue for 30 months.
During the last decade, diversification technologies unleashed major killer apps of today’s consumer, health care and industrial market. Innovations like MEMS motion sensors, portable healthcare devices and robotics, created leading well recognized centres of excellence in Europe. The ENIAC JU project Lab4MEMS will establish a distributed European pilot line for innovative microelectromechanical systems using advanced piezoelectric and magnetic materials, including advanced packaging technologies.
The Pilot Line is promoted to reinforce the manufacturing facilities currently located in each respective participating country, aiming to implement and optimize the industrial processes and to validate the demonstrators suitable to penetrate the market. The locations are therefore distributed among the national clusters of the consortia, streaming the operations from front-end to back-end.
Innovations generated by these coordinated technology capabilities which are expected to fuel the next generation’s smart sensors and actuators based on MEMS, targeting the following demonstrators:
- Micro-actuators, micro-pumps, sensors and electrical power generators, integrated on silicon-based piezoelectric materials (PZT) – for use in Data Storage, Ink Jet, Health Care, Automotive and Energy Scavenging
- Magnetic field sensors integrated on silicon-based Anisotropic Magneto Resistance (AMR) materials. – for use in consumer applications such as GPS positioning and mobile phones
- Advanced packaging technologies and vertical interconnections (flip chip, Through Silicon Vias or Through Mold Vias) for full 3D integration. – For use in CONSUMER and HEALTHCARE application such as body area sensors and remote monitoring
The research leading to these results has received funding from the European Community under the ENIAC Nanoelectronics Framework Programme (Call ENIAC-2012-2) under grant agreement no Lab4MEMS(325622-2)